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 Semiconductor III-V Group -
ACM - ACM’s Ultra CTH 12-inch Single Wafer Cleaning Equipment |
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| ACM’s Ultra CTH 12-inch Single Wafer Cleaning Equipment |
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Ultra CTH provides solutions to device yield enhancement
for 65nm technology and beyond through SAPS Megasonic
technology (patent pending). SAPS megasonic technology
delivers exceptionally high Particle Removal Efficiency
(PRE over 99%) and is damage-free to devices by eliminating
“hot spots” as results of highly uniform megasonic power
density across wafer. Using Ultra CTH, high PRE with
only DIW has been demonstrated, yet it offers customers
the flexibility of connecting up to 5 chemicals simultaneously;
all can be separated and reclaimed.
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| Features: |
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SAPS Megasonic technology – High PRE; damage-free |
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Uniform megasonic power density: WIWNU <2% |
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Customizable multi-chemical recycle and reclaim capability: low COC |
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Flexible chemical hook-up: suitable for various applications |
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Company Profile
