 |
Multiple contact & proximity exposure modes |
|
|
Wafer size from pieces to 200 mm diameter |
|
|
Square substrate up to 7x7 |
|
|
Optical and CCTV split field microscope options |
|
|
Simple topside mask loading |
|
|
Manual tray loading feature |
|
|
Modular design, easily configurable for wide variety of applications with available options: |
| - |
Robotic auto load handling |
| - |
Automatic alignment |
| - |
Optical (OBS) and Infrared (IR) backside alignment |
| - |
Large gap alignment |
| - |
UV / NUV / DUV Exposure optics |
Company Profile
Semiconductor III-V Group - Neutronix_Quintel - Model 8000
