| - Substrate size from
pieces to 150 mm diameter |
| |
| - Manual X, Y and
theta alignment stage |
| |
| - Vacuum / Pressure
contact exposure modes |
| |
| - Optical Splitfield
and CCTV microscope options |
| |
| - Simple, topside mask
loading |
| |
| - Low maintenance |
| |
- Available Options:
ˇ´Infrared (IR) back side alignment
ˇ´Large gap alignment
ˇ´UV / NUV / DUV exposure optics
ˇ´Carousel load |
Company Profile
Semiconductor III-V Group - Neutronix_Quintel - Model 4006
