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  半導體III-V 族 - ULVAC - 乾式蝕刻設備 RISE-300



乾式蝕刻設備 RISE-300
icon
icon DRAM,NAND Batch Type Chemical Dry Native Oxide Etching
icon 90 % share @ W/W *2
icon Pre Cleaning Si Epi :
icon Elevated Source/Drain Fin FET
icon Native oxide film removal: Self-align Contact
應用於Logic, NAND, DRAM, TSV, LED & Power Device etc半導體光電產業之乾蝕刻設備具有高產出,低成本之競爭優勢。
 
 
 
 
 
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