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  半導體III-V 族 - KOSTEK systems 株式會社 - KOSTEK R-8000 Descum 系列



KOSTEK R-8000 Descum 系列
具獨立製程腔體的高均勻性電漿系統以及彈性化的製程腔體設計。
特點:
icon 最多可擴充至4個製程腔體。
icon 各腔體可分別生產不同製程。
icon 比競爭對手有更高的產能。
icon 8吋與12吋製程共用。
標準規範:
icon WiW均勻性≦5%
icon WtW均勻性≦3%
應用:
icon 適用PR、PI、PBO與BCB除渣製程。
規格:
icon Features:
1. High performance by unique plasma source and chamber design.
2. Up to 4 separated process modules.
3. Low down time due to independent 2 transfer modules.
4. Compatible for 12” and 8” wafer.
5. Various process combination for customer’s convenience.
ex ) PM1 & 2 : PR process; PM3 & 4 : PI or PBO process
ex ) PM1 & 2 : 12 inch wafer process; PM3 & 4 : 8 inch wafer process
6. Higher throughput than competitors.
Specifications:
1. Within wafer uniformity : ≤ ±5.0 [%]
2. Wafer to wafer uniformity : ≤ ±3.0 [%]
Process applications
Descum of photo resist, polyimide, BCB, and PBO in the bumping process.
 
 
 
 
 
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