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  半導體III-V 族 - ClassOne - 電鍍機 Electroplating 量產型 Production Solstice S4/S8



電鍍機 Electroplating 量產型 Production Solstice S4/S8
Electroplating Systems for 75-200mm Substrates
高性價比量產型電鍍機,給200mm或以下的產品使用。
如果您的產品尺寸在200mm或更小,您不需要向大型半導體供應商購買一個大且昂貴的300mm電鍍機台。 Solstice®是一種更智能,更經濟實惠的解決方案。
特點:
icon 1.Use for plating, cleaning or etching
2.For 75mm to 200mm substrates
3.Simple diameter change
4.Faster plating rates, higher throughput
5.Superior control, higher uniformity
6.From 2 to 8 process chambers
7.For thin or bonded substrates
8.For transparent or opaque substrates
9.Powerful Windows-based software
10.Broad process flexibility
標準規範:
icon Solstice Plating System
Best of West Winner
Semicon West 2015
應用:
icon 1. Cu, Au, Ni, Sn, Ti , alloys and more
2. Cu TSV
3. Cu Pillar
4. Cu Bump
5. Cu RDL and Pad
6. Cu Damascene
7. Wafer Level Packaging
8. Cyanida and non-cyanide Au
9. Low-stress Ni
10. Lead-free solder
規格:
icon
 
 
 
 
 
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