| Unique technologies improve wafer performance |
| 特點: |
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1. Wide FOC Image acquisition
2. High sensitivity
3. Die to Database algorithm
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| 標準規範: |
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| 應用: |
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| 規格: |
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Max: 70um x 70um
Enough sensitivity for defect inspection beyond 1xnm process
Comparison between design data and SEM image with high speed and high accuracy
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半導體III-V 族 -
NGR - NGR 3510
